- Product Details
Keywords
- Electroplating Chemicals
- Stannous methanesulfonate
- Tin methane
Quick Details
- ProName: Tin methanesulfonate
- CasNo: 53408-94-9
- Molecular Formula: Sn(CH3SO3)2
- Appearance: Colorless transparent liquid
- Application: It is the main compound of the tin pla...
- PackAge: 20 L/drum; 200 L/ drum; 5 gallon/drum;...
- ProductionCapacity: Metric Ton/Day
- Purity: 19.5%~21.5%
- Storage: Sealed, dry, microtherm
- LimitNum: 0 Metric Ton
- Grade: Electron Grade
- Stannous tin, Sn2+: 19.5~20.5 %
- Total tin: 19.5~21.5 %
- Stannic tin, Sn4+: ≤0. 7%
- Free MSA(as CH3SO3H): 5.5~7.5 %
- Sulfate (SO4 2-): ≤500 ppm
- Chloride (Cl-): ≤50 ppm
- Lead (Pb): ≤20 ppm
- Iron (Fe): ≤10 ppm
- Cobalt (Co): ≤5 ppm
- Nickel(Ni): ≤5 ppm
- Zinc(Zn): ≤5 ppm
- Copper(Cu): ≤10 ppm
Superiority
1. Advanced production technique ensures high tin content and acid ions and high stability of bivalent tin.Low content of quadrivalent tin, organic impurity, metallic impurity ions, etc, guarantees a high stability of our products.
2. Having high stability bivalent tin, together with appropriate additives can maintain a long usage lifespan.
3. With fine plating ability, high dispersion and deposition speed, it can be adopted in a wide range of different electricity density.
4.With low metallic and non-metallic impurities and high purity of plated coatings, it can prevent joints from color changes under extreme heat when used in the electronic SMT jointing technique.